Method for improving resist pattern peeling

ABSTRACT

A method of fabricating a mask is described. The method includes receiving receiving an integrated circuit (IC) design layout that has a first pattern layer including a first feature and has a second pattern layer including a second feature, wherein the first pattern layer and the second pattern layer are spatially related when formed in a substrate such that the first and second features are spaced a first distance between a first edge of the first feature and a second edge of the second feature, modifying the IC design layout by adjusting a dimension of the first feature based on the first distance, and generating a tape-out data from the modified IC design layout for mask making. The method further includes applying a logic operation (LOP) to the IC design layout.

BACKGROUND

The semiconductor integrated circuit (IC) industry has experiencedexponential growth. Technological advances in IC materials and designhave produced generations of ICs where each generation has smaller andmore complex circuits than the previous generation. In the course of ICevolution, functional density (i.e., the number of interconnecteddevices per chip area) has generally increased while geometry size(i.e., the smallest component (or line) that can be created using afabrication process) has decreased. This scaling down process generallyprovides benefits by increasing production efficiency and loweringassociated costs. Such scaling down has also increased the complexity ofprocessing and manufacturing ICs and, for these advances to be realized,similar developments in IC processing and manufacturing are needed.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is best understood from the following detaileddescription when read with accompanying figures. It is emphasized that,in accordance with the standard practice in the industry, variousfeatures are not drawn to scale and are used for illustration purposeonly. In fact, the dimension of the various features may be arbitrarilyincreased or reduced for clarity of discussion.

FIGS. 1 and 2 are cross-sectional side views of forming a resist patternon a device according to one or more embodiments.

FIG. 3 is a flow chart of a method of forming a resist pattern forimplementing one or more embodiments.

FIGS. 4-7 are cross-sectional side views of forming a resist pattern ofa device according to one or more embodiments.

FIG. 8 is a flow chart of a method of forming a mask for implementingone or more embodiments.

FIGS. 9 and 10 are examples of adjusting a feature dimension forimplementing ore or more embodiments

FIG. 11 is an exemplary table adjusting a feature dimension forimplementing one or more embodiments.

DETAILED DESCRIPTION

For example, lithography processes often implement exposing anddeveloping processes to pattern small features during IC waferfabrication and mask fabrication. One of the challenges that ariseduring the lithography processes is a resist pattern peeling with thefeature size scaling down. The resist pattern peeling may interfererwith an ion implantation process or an etching process, and may furtherimpact the performance of the IC devices.

The following disclosure provides many different embodiments, orexamples, for implementing different features of the invention. Specificexamples of components and arrangements are described below to simplifythe present embodiments. These are, of course, merely examples and arenot intended to be limiting. For example, the formation of a firstfeature over or on a second feature in the description that follows mayinclude embodiments in which the first and second features are formed indirect contact, and may also include embodiments in which additionalfeatures may be formed between the first and second features, such thatthe first and second features may not be in direct contact. In addition,the present disclosure may repeat reference numerals and/or letters inthe various examples. This repetition is for the purpose of simplicityand clarity and does not in itself dictate a relationship between thevarious embodiments and/or configurations discussed.

It will be understood that although the terms “first” and “second” maybe used herein to describe various features, layers and/or regions,these features, layers and/or regions should not be limited by theseterms. These terms are only used to distinguish one feature, layer orregion from another feature, layer or region. Thus, a first feature,layer or region discussed below could be termed a second feature, layeror region, and similarly, a second feature, layer or region may betermed a first feature, layer or region without departing from theteachings of the present disclosure.

Referring now to FIGS. 1-2, cross-sectional side view examples of asemiconductor structure 100 having a resist pattern formed thereon usinga mask 200 are illustrated according to various embodiments of thepresent disclosure. The semiconductor structure 100 includes a wafersubstrate 102, a first feature 104 embedded in the substrate 102 (asshown in FIG. 1), an interfacial layer 106 disposed on the wafersubstrate 102, and a second feature 108 disposed on the interfaciallayer 106 (as shown in FIG. 2).

As shown in FIGS. 1 and 2, a resist film 110 is deposited on a wafersubstrate 102, for example, by a spin on coating process. The resistfilm 110 is exposed using the mask 200 on an exposing tool. During anexposing process, a light is projected on the mask 200. Portion of thelight is blocked or absorbed by a patterned opaque layer 204 formed on amask substrate 202 and a patterned light 206 is projected to the resistfilm 110. A portion of the resist film 110 is not exposed by thepatterned light 206. After a developing process, a non-exposed portion112 remains and forms a resist pattern over the wafer substrate 102.However, because of topography and composition complexity of a wafersubstrate, a resist pattern may be deviated from the expected patterndefined in the mask 200.

Continuing the present embodiments, the wafer substrate 102 may includea different material compared to the first feature 104 embedded in thewafer substrate 102, the first interfacial layer 106 disposed on thewafer substrate 102, or the second feature 108 disposed on theinterfacial feature 106. For example, the wafer substrate 102 includessilicon, the first feature 104 includes silicon oxide, the interfaciallayer 106 includes silicon oxide, and the second feature 108 may includepoly silicon. A light may change traveling direction (be diffracted)when the light hit an interface between two different materials. Thechanging of light traveling direction may have severe impact on a resistpattern formed on a wafer substrate.

In one example, as shown in FIG. 1, the patterned light 206 changestraveling direction while hitting an interface between the first feature104 and the interfacial layer 106, travels towards bottom of the wafersubstrate 102, and changes the traveling direction again and travelstoward the non-exposed portion 112 while hitting the bottom of the wafersubstrate 102. A portion of the non-exposed portion 112 is exposedbecause of a light diffraction or reflection. The non-expected exposuremay reduce dimension of a resist pattern and further cause peeling ofthe resist pattern.

In another example, as shown in FIG. 2, the patterned light 206 changestraveling direction and travels toward to the non-exposed portion 112while hitting an interface between the second feature 108 disposed onthe interfacial layer 106 and the resist film 110 deposited on theinterfacial layer 106. A portion of the non-exposed portion 106 isexposed because of a light diffraction or reflection at the interface.The non-expected exposure may reduce dimension of a resist pattern andfurther cause peeling of the resist pattern.

Referring to FIG. 3, a flow chart of a method 300 is one embodiment offorming a resist pattern on a substrate. FIGS. 4-7 are cross sectionalviews of a semiconductor structure 400 at various fabrication stages andfabricated by the method 300. The method 300 is described with thesemiconductor structure 400 as an example for illustration.

The method 300 begins at operation 302 by providing or receiving a wafersubstrate. The wafer substrate may include a wafer and a plurality ofconductive and non-conductive thin films. The wafer is a semiconductorsubstrate including silicon (in other words, a silicon wafer).Alternatively or additionally, the wafer includes another elementarysemiconductor, such as germanium; a compound semiconductor includingsilicon carbide, gallium arsenic, gallium phosphide, indium phosphide,indium arsenide, and/or indium antimonide; or an alloy semiconductorincluding SiGe, GaAsP, AlInAs, AlGaAs, GaInAs, GaInP, and/or GaInAsP. Inyet another alternative, the wafer is a semiconductor on insulator(SOI).

The wafer substrate further includes a plurality of features buried orembedded in the substrate. In the present embodiments, a feature buriedor embedded in a wafer substrate is also referred to as a materialfeature or a material pattern. For example, the wafer substrate includevarious isolation features, such as shallow trench isolation (STI),formed by a process, such as a process including etching to form varioustrenches and then depositing to fill the trench with a dielectricmaterial. The wafer substrate may include doped features, such as n-typewells and/or p-type wells, formed by ion implantation or diffusion orstrained features formed by an epitaxial (EPI) growth. The wafersubstrate also includes a plurality of conductive layers, non-conductivelayers, or combination thereof as an interfacial layer. In the presentembodiments, a material included in a feature buried in a wafersubstrate is substantially different from a material included in thewafer substrate, and a material included in an interfacial layer is alsosubstantially different from the wafer substrate. When a patternedelectromagnetic radiation beam hitting an interface between the featureand the wafer substrate, a travelling direction of the patternedelectromagnetic radiation beam may change. Referring to the example ofFIG. 4, a wafer substrate 402, a material feature 404 buried in thewafer substrate 402, and an interfacial layer 406 deposited over thewafer substrate 402 and the material feature 404 are illustrated.

The method 300 proceeds to operation 304 by depositing a resist film onthe wafer substrate, for example, by a spin-on coating process. A resistfilm may include a single resist layer or a multiple resist layers. Aresist film may be a positive resist or a negative resist. The operation304 may include performing a dehydration process before applying theresist film on the wafer substrate, which can enhance an adhesion of theresist film to the wafer substrate. The dehydration process may includebaking the substrate at a high temperature for duration of time, orapplying a chemical, such as hexamethyldisilizane (HMDS), to thesubstrate at high temperature. The operation 304 may also include a softbake (SB), which drive solvents out of the resist film deposited on thewafer substrate and can increase mechanical strength of the resist film.The operation 304 may include applying a bottom anti-reflective coating(BARC) to reduce reflection and improve the resist pattern profile. FIG.5 illustrates that a resist film 408 is deposited over the interfaciallayer 406 and the wafer substrate 402 including the material feature404.

The method 300 proceeds to operation 306 by exposing the resist filmdeposited on the wafer substrate by a radiation beam utilizing aphotomask in an exposing tool. In an alternative embodiment, an electronbeam is used to expose the resist film in an electron beam writer. Inone embodiment, an optical exposing tool includes ultraviolet (UV)I-line light, deep ultraviolet (DUV) light, extreme ultraviolet (EUV)light, or X-ray exposing tool. In the example of the optical exposingtool, a photomask (mask or reticle) is needed. The mask includes abinary mask (BIM), or a phase shift mask (PSM). The phase shift mask mayinclude an alternative phase shift mask (alt. PSM) or an attenuatedphase shift mask (att. PSM). FIG. 6 illustrates the exposed the resistfilm 408 on the interfacial layer 406 and the wafer substrate 402, by aradiation beam 410.

The method 300 proceeds to operation 308 by developing the exposedresist film to form a resist pattern on the substrate. The operation 308includes applying a developer, such as tetra-methyl ammonium hydroxide(TMAH), on the exposed resist film. The operation 308 may furtherinclude a post expose bake (PEB), a post develop bake (PDB), or both.The operation 308 may also include a final rinse process. Additionaloperations may be implemented before, during, and after the method 300,and some of the operations described may be replaced, eliminated, ormoved around for additional embodiments of the method 300. The method300 is one embodiment, and is not intended to limit the presentinvention beyond what is explicitly recited in the claims. Referring tothe example of FIG. 7, a resist pattern 412 formed on the interfaciallayer 406 and the wafer substrate 402 including the material feature 404is illustrated.

In the present embodiments, a dimension of a resist pattern isdetermined by a dimension of the corresponding opening defined in themask. However, the dimension of the resist pattern is impacted bydiffraction, refraction, reflection of the radiation beam 410 at aninterface between two different materials on and/or in a wafersubstrate. Therefore, the dimension of the opening in the mask isadjusted to compensate or offset the impact on the dimension of theresist pattern caused by diffraction, refraction, reflection of theradiation beam 410 at an interface between two different materials onand/or in a substrate. Further, a resist pattern quality is improved bythe adjustment of the dimension of the opening defined in the mask andassociated with the radiation beam 410. The dimension of the resistopening pattern is compensated. Adjudging the dimension of the openingin the mask (accordingly the exposing radiation pattern) is implementedby adjusting the dimension of the corresponding feature in the IC designlayout according to the pattern in another layer, which will bediscussed in more detail later.

In the present embodiments, as shown in FIG. 7, the resist patterns 412is formed on the interfacial layer 406 deposited over the wafersubstrate 402 having the feature 406 buried in the wafer substrate 402.

Referring now to FIG. 8, a flow chat of a method 500 of fabricating amask is illustrated for benefiting one or more embodiments. The method500 begins at operation 502 by providing or receiving an IC designlayout (or IC design layout data) from a designer. The designer can be aseparate design house or can be part of a semiconductor fabricationfacility (fab) for making IC productions according to the IC designlayout. The IC design layout includes a plurality of main features (orfeatures) designed for an IC product and based on a specification of theIC product. In the present embodiments, the IC design layout includes afirst pattern layer having a first feature and a second pattern layerhaving a second feature. A feature is also referred to as a polygon. Thefirst pattern layer and the second pattern layer are spatially relatedwhen formed in a wafer substrate such that the first and second featuresare spaced a distance between a first edge of the first feature and asecond edge of the second feature. The distance is measured in a topview toward the first and second pattern layers. In one embodiment, thefirst feature is corresponding to a material feature formed on or in awafer substrates and the second feature is corresponding to a resistpattern to be formed over the material feature on the wafer substrate.

The method 500 proceeds to operation 504 by performing a logic operation(LOP) to the IC design layout such that the IC design layout is tunedwith small bias corrections, which may be requested by a semiconductorfab according to the semiconductor manufacturing data. In the presentembodiments, the operation 504 also includes identifying the secondfeature of the second pattern layer according to the first feature inthe first pattern layer. The second feature in the second pattern layeris vertically overlying the first feature of the first pattern layerwhen formed on the wafer.

In the present embodiment, the LOP includes finding an adjustment to thedimension of the second feature according to the distance between thefirst edge of the first feature and the second edge of the secondfeature. In one embodiment, if a designed dimension of the secondfeature is greater than a first predetermined value or the distancebetween two adjacent second features is smaller than a secondpredetermined value, adjusting the designed dimension of the secondfeature is not needed. In this case, the adjustment is zero. In anotherembodiment, if the designed dimension of the second feature is less thanthe first predetermined value, the distance between the second featureand an adjacent feature in the second pattern layer is greater than thesecond predetermined value, and the distance between a first edge of thefirst feature and a second edge of the second feature is larger than athird predetermined value, a fourth predetermined value is added to theoriginally designed dimension of the second feature from each side. Theadjusted dimension of the second feature X=X0+2D, wherein X0 is theoriginally designed dimension of the second feature and D is the fourthpredetermined value. In this case, the adjustment is 2*D. The first,second, third, and fourth predetermined values may changes with asubstrate, an exposing tool, or a resist film changing.

FIG. 9 is an exemplary IC design layout 600 according to one or moreembodiments. FIG. 10 is an example of a semiconductor structure 650associated with the design layout 600. The operation 504 is furtherexplained with reference to FIGS. 9 and 10. The design layout 600includes a first feature 604 of a first pattern layer and a secondfeature 612 of a second pattern payer. X is a designed dimension of thesecond feature 610. Y is a distance between a first edge of the firstfeature 604 and a second edge of the second feature 612 in a horizontaldirection parallel to the first and second pattern layers when formed onthe substrate. A is a distance between the two adjacent second feature612.

FIG. 10 is an example of a semiconductor structure 650 associated withthe design layout 600. The semiconductor structure 650 includes thewafer substrate 402, the material feature 404 buried in the wafersubstrate 402, the interfacial layer 406 deposited over the wafersubstrate 402 and the material feature 404, and the resist pattern 412formed over the interfacial layer 406 and the material feature 404. Thematerial feature 404 of device 650 associates with the first feature 604of the layout 600 while formed in wafer a substrate. The resist pattern412 of the device 650 associates with the second feature 612 of thelayout 600 while formed on a substrate. The semiconductor structure 650is provided for illustration and it is to be understood that there mightbe a dimensional discrepancy between a feature in the design layout 600and a corresponding feature in the semiconductor structure 650.

In one embodiment, if the designed dimension X of the second feature 612is larger than a first predetermined value or the distance A between thetwo adjacent second features 612 is smaller than a second predeterminedvalue, adjusting the designed dimension X of the second feature 612 isnot needed. In other words, the fourth predetermined value D is zero.

In another embodiment, if the designed dimension X of the second feature612 is smaller than a first predetermined value, the distance A betweenthe two adjacent second features 612 is larger than a secondpredetermined value, and the distance Y between the first edge of thefirst feature 604 and the second edge of the second feature 612 issmaller than a third predetermined value, adjusting the designeddimension X of the second feature 610 is not needed. In other words, thefourth predetermined value D is zero.

In an alternative embodiment, if the designed dimension X of the secondfeature 612 is smaller than the first predetermined value, the distanceA between the two adjacent second features 612 is larger than the secondpredetermined value, and the distance Y between the first edge of thefirst feature 604 and the second edge of the second feature 612 islarger than a third predetermined value, adjusting the designeddimension X of the second feature 612 by adding the fourth predeterminedvalue D to each side of the second feature 612 is performed. The fourthpredetermined value D is a function of the distance Y between the firstedge of the first feature 604 and the second edge of the second feature612.

In one embodiment, dimension of a resist pattern is controlled byadjusting dimension of an associated feature on a mask used on anexposing tool, for example, a scanner or a stepper. In anotherembodiment, dimension of a resist pattern may be controlled by adjustingdimension of an associated patterned radiation beam on an exposing tool,for example, an electron beam writer.

Referring to FIG. 11, a table 700 illustrating various examples ofadjustments to the designed dimension of a resist pattern. The table 700provides various embodiments of the LOP for the adjustment at theoperation 504. The table 700 is described with further reference toFIGS. 9-10. In one example, if the designed dimension X is larger than300 nm or the distance A is smaller than 220 nm, adjusting the dimensionX by adding zero is performed. In other words, no adjustment is needed.In another example, if the designed dimension X is smaller than 300 nm,the distance A is larger than 220 nm, and the distance Y is smaller than85 nm, adjusting the dimension X by adding zero is performed. In otherwords, no adjustment is needed. In an alternative example, if thedesigned dimension X is smaller than 300 nm, the distance A is largerthan 220 nm, and the distance Y is larger than 85 nm, adjusting thedesigned dimension X by adding 20 nm to each side of the designeddimension X is performed. In other words, 40 nm is added to the designeddimension X. In one example, If the designed dimension X is smaller than300 nm, the distance A is larger than 220 nm, and the distance Y islarger than 95 nm, adjusting the designed dimension X by adding 30 nm toeach side of the dimension X is performed. In other words, 60 nm isadded to the designed dimension X.

Referring back to FIG. 8, the operation 504 includes adjusting thedimension of the second feature of the second pattern layer.Particularly, the adjustment to the dimension of the second feature isbased on the originally designed dimension of the second feature, thedistance between the second feature and an adjacent feature in thesecond pattern layer, and distance between a first edge of the firstfeature and a second edge of the second feature. In the presentembodiments, adjusting a dimension of a feature is implemented at anoperation in which an optical proximate correction (OPC) is applied tothe IC design layout.

The method 500 proceeds to operation 506 by generating a tape-out datafor a mask shop to fabricate a mask using the modified IC design layout.The mask shop may be part of a semiconductor fab making an IC device, oran independent mask making shop.

The method 500 may include an operation 510 by making a mask accordingto the tape-out data. The operation 510 includes fracturing the tape-outdata into a plurality of essential rectangles or trapezoids. Creating aplurality of design layout patterns on the mask is carried out by a maskwriter, for example, an electron beam writer, an ion beam writer, or alaser beam writer. In one embodiment, the mask includes a transparentsubstrate, such as fused quartz, calcium fluoride (CaF₂), or othersuitable material. The mask layer also includes an opaque layerpatterned according to the modified IC design layout. The opaque layerincludes an opaque material, such as chromium (Cr), chromium oxide(CrO), titanium nitride (TiN), tantalum nitride (TaN), tantalum (Ta),titanium (Ti), or aluminum-copper (Al—Cu), palladium, tantalum boronnitride (TaBN), aluminum oxide (AlO), molybdenum (Mo), or other suitablematerials. In another embodiment, the mask is reflective mask for EUVlithography technology. In this embodiment, the mask substrate mayinclude a low thermal expansion material (LTEM). The mask substrateserves to minimize image distortion due to mask heating by theintensified illumination radiation. Multiple material layers, such asalternating Mo/Si films, are formed on the LTEM substrate and patternedaccording to the modified IC design layout.

The operation 510 may include performing an inspection on featuresformed on the mask substrate for quality control and assurance. Theoperation 510 may include repairing the mask if a printable defect isfound on the mask. The operation 510 may further include installing apellicle over the features formed on the mask substrate to prevent aparticle from falling on the features formed on the mask substrate.Additional operations can be provided before, during, and after themethod 500, and some the operations described can be replaced,eliminated, or moved around for additional embodiments of the method500. The method 500 is example embodiments, and is not intended to limitthe present invention beyond what is explicitly recited in the claims.

Thus, a method of fabricating a mask is described. The method includesreceiving an integrated circuit (IC) design layout that has a firstpattern layer including a first feature and has a second pattern layerincluding a second feature, wherein the first pattern layer and thesecond pattern layer are spatially related when formed in a substratesuch that the first and second features are spaced a first distancebetween a first edge of the first feature and a second edge of thesecond feature, modifying the IC design layout by adjusting a dimensionof the first feature based on the first distance, and generating atape-out data from the modified IC design layout for mask making. Themethod further includes applying a logic operation (LOP) to the ICdesign layout.

In one embodiment, a method of making a resist patterned is presented.The method includes receiving a substrate having a material featureembedded in the substrate, depositing a resist film on the substrate andthe material feature, and exposing the resist film according to a designpattern having a first feature to form the resist pattern overlaying thematerial feature on the substrate, wherein first feature and thematerial feature are spatially related, the resist pattern and thematerial feature are spaced a first distance between a first edge of thefirst feature and a second edge of the material feature in a top view.The first feature has a dimension that is a function of the firstdistance. The method further includes developing the exposed resist filmdeposited on the substrate.

In another embodiment, a method of forming a resist pattern isdescribed. The method includes receiving a substrate having a materialfeature buried in the substrate, depositing a resist film on thesubstrate and the material feature, and exposing the resist filmaccording to a mask having a first feature to form the resist patternoverlaying the material feature on the substrate. The first feature andthe material feature are spatially related. The first feature and thesubstrate pattern are spaced a first distance between a first edge ofthe resist pattern and a second edge of the material feature. Adimension of first feature is a function of the first distance.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

1-7. (canceled)
 8. A method of forming a resist pattern, the methodcomprising: receiving a substrate having a material feature embedded inthe substrate; depositing a resist film on the substrate and thematerial feature; and exposing the resist film according to a designpattern having a first feature to form the resist pattern overlaying thematerial feature on the substrate, wherein the first feature and thematerial feature are spaced a first distance between a first edge of thefirst feature and a second edge of the material feature in a top view,wherein the first feature has a dimension that is a function of thefirst distance.
 9. The method of claim 8, further comprising developingthe exposed resist film deposited on the substrate.
 10. The method ofclaim 8, wherein the exposing the resist film includes applying one of alight beam, an electron beam and an ion beam.
 11. The method of claim10, wherein the applying of the optical beam includes using a mask. 12.The method of claim 8, wherein the dimension of the first feature isincreased by a first value when the first distance is larger than afirst predetermined value.
 13. The method of claim 12, wherein the firstvalue is zero when the dimension of the first feature is larger than asecond predetermined value.
 14. The method of claim 13, wherein thefirst value is zero when the a second distance between the first featureand an adjacent feature is smaller than a second predetermined value.15. A method of forming a resist pattern, the method comprising:receiving a substrate having a material feature buried in the substrate;depositing a resist film on the substrate and the material feature; andexposing the resist film according to a mask having a first feature toform the resist pattern overlaying the material feature on thesubstrate, wherein the first feature and the material feature arespatially related; the first feature and the substrate pattern arespaced a first distance between a first edge of the resist pattern and asecond edge of the material feature; and a dimension of first feature isa function of the first distance.
 16. The method of claim 15, furthercomprising developing the exposed resist film deposited on thesubstrate.
 17. The method of claim 15, wherein the dimension of thefirst feature is adjusted by adding a value when the first distance islarger than a first predetermined value.
 18. The method of claim 17,wherein the value is a function of the first predetermined value. 19.The method of claim 17, wherein the value is zero when the dimension offirst feature is larger than a second predetermined value.
 20. Themethod of claim 17, wherein the value is zero when a second distancebetween two adjacent resist patterns is smaller than a secondpredetermined value.
 21. A method, comprising: receiving a substratehaving a material feature embedded in the substrate; forming a resistpattern overlaying the material feature on the substrate, wherein theresist pattern includes a first feature, wherein the first feature andthe material feature are spaced a first distance between a first edge ofthe first feature and a second edge of the material feature in a topview, and wherein the first feature has a dimension that is a functionof the first distance.
 22. The method of claim 21, wherein forming theresist pattern includes exposing a resist film by applying one of alight beam, an electron beam and an ion beam.
 23. The method of claim22, further comprising developing the exposed resist film deposited onthe substrate.
 24. The method of claim 22, wherein the applying of theoptical beam includes using a mask.
 25. The method of claim 21, whereinthe dimension of the first feature is increased by a first value whenthe first distance is larger than a first predetermined value.
 26. Themethod of claim 25, wherein the first value is zero when the dimensionof the first feature is larger than a second predetermined value. 27.The method of claim 26, wherein the first value is zero when the asecond distance between the first feature and an adjacent feature issmaller than a second predetermined value.